Event ·Multi-source

瑞银预测英特尔将代工AMD芯片，EMIB-T封装良率达90%

瑞银最新研报指出，因台积电CoWoS先进封装产能受限，AMD可能将AI加速卡代工订单转交英特尔，并采用其EMIB-T封装方案。据报道，英特尔EMIB-T封装良率已接近90%，但基板良率目前仅停留在50%。英特尔预计2027年批量供应EMIB-T封装，谷歌、苹果、SpaceX等也有望成为其代工客户。

Current read

瑞银说英特尔要接AMD的AI芯片代工，EMIB-T封装良率都快90%了，不过基板还有瓶颈，想了解芯片代工格局可以看这个。

10 sources67° AI heatLast updated 2026/8/14 06:41:16

Evidence

10 sources

Primary sourceIT之家

2026/8/14 06:41:16View source

Related source 1AI Will

2026/8/13 09:23:17View source

Related source 2Cursor

2026/8/14 13:02:24View source

Related source 3xAI

2026/8/14 13:03:18View source

Related source 4eric zakariasson

2026/8/14 15:17:52View source

Related source 5Sualeh Asif

2026/8/14 16:05:01View source

Related source 6Akshay Kothari

2026/8/14 16:29:21View source

Related source 7Aadit Sheth

2026/8/14 17:23:59View source

Related source 8Scott Wu

2026/8/14 21:00:17View source

Related source 9techcrunch

2026/8/15 16:30:00View source

Conflict check

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