Event ·Multi-source

NVIDIA 下代 Groq LPU 芯片或转向 3D 堆叠 DRAM，弃用大 SRAM 方案

据韩媒 ZDNET Korea 10 月 20 日报道，NVIDIA 的下代 Groq LPU AI 推理加速器有望采用基于 TSV（硅通孔）工艺的 3D 堆叠 DRAM 方案。现款 Groq LPU 采用大容量 SRAM 缓存设计以实现快速解码，但 SRAM 存在容量小、制程升级密度收益有限的问题。同样走大 SRAM 路线的 Cerebras 此前也已预告其 CS-6 芯片将首次垂直集成 DRAM。

Current read

Groq 那块靠大 SRAM 出名的 LPU 芯片要换路线了，NVIDIA 打算改用 3D 堆叠 DRAM，Cerebras 也在做同样的事。

11 sources52° AI heatLast updated 2026/10/21 03:24:30

Evidence

11 sources

Primary sourceIT之家

2026/10/21 03:24:30View source

Related source 1rohanpaul_ai

2026/10/21 08:09:03View source

Related source 2Latent.Space

2026/10/19 15:03:00View source

Related source 3CNBC Indonesia Tech

2026/10/19 03:25:00View source

Related source 4TestingCatalog

2026/10/19 10:37:14View source

Related source 5Decoder

2026/10/19 11:33:36View source

Related source 6NVIDIA AI

2026/10/19 12:30:09View source

Related source 7elvis

2026/10/19 13:46:05View source

Related source 8Ate-a-Pi

2026/10/19 13:55:22View source

Related source 9Gary Marcus

2026/10/19 17:13:08View source

Related source 10Y Combinator

2026/10/19 17:28:38View source

Conflict check

Dedup data only shows that these sources discuss the same event, not that they agree. There is no structured supporting or refuting evidence yet, so no conflict is inferred automatically.

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