华为用封装技术绕过芯片限制
华为推出122.88TB AI SSD，采用Die-on-Board封装技术，将NAND芯片直接焊在电路板上，而非依赖三星400+层3D NAND。该方案通过提高板级密度实现高容量，但面临散热和信号问题。未来计划推出245TB版本。此举表明出口管制迫使创新转向封装而非芯片本身。
🇨🇳 🇺🇸 China's Huawei’s new 122TB SSD shows how exp…
🇨🇳 🇺🇸 China's Huawei’s new 122TB SSD shows how export controls can move innovation sideways instead of simply stopping it.
Huawei just built a 122.88TB AI SSD by changing the package around the memory, not by matching Samsung’s most advanced 400+ layer 3D NAND.
And a 245TB version discussed as a future step.
High-capacity SSDs usually grow by stacking more NAND layers inside each chip, but Huawei’s access to those chips is blocked because its Entity List status restricts items tied to US technology.
So it is not trying to win only by making taller 3D NAND stacks, where Samsung has already shown 400-plus-layer V-NAND work.
Instead, Huawei is shifting the contest from the chip itself to the way chips are packed together.
Huawei’s workaround is Die-on-Board, which puts NAND dies directly onto the circuit board, cuts out some normal chip packaging, and raises board-level density by packing more lower-density memory into the same device.
Direct die placement creates heat and signal problems, but it shows how packaging can recover some of the capacity lost when a company cannot buy the best memory chips.