精选理由
英特尔砸10亿搞玻璃基板
玻璃基板和玻璃中介层正成为先进芯片封装中传统有机基板和硅中介层的替代方案。英特尔已投入超过10亿美元研发玻璃基板技术。多家厂商正在竞相克服玻璃基板制造的工艺难题。该技术有望降低封装厚度并提升信号传输效率。
原文 · Pandaily
Glass Substrates Set to Reshape Semiconductor Packaging as Industry Giants Pour Billions Into Technology
Glass substrates and glass interposers are emerging as key replacements for traditional organic substrates and silicon interposers in advanced chip packaging, with Intel investing over $1 billion and multiple players racing to overcome manufacturing hurdles.