精选理由
WAIC 2026上，Biren、Kunlun Chip等五家都发了超节点系统，单芯片拼参数时代结束，现在看集群互联。
在WAIC 2026上，Biren、Yixin Intelligent、Infinigence CoreX、Kunlun Chip和SingularMOL均发布了超节点级系统。超节点通过多芯片互联扩展算力，取代单芯片性能竞赛。中国AI基础设施的竞争焦点已转向集群级方案。
原文 · Pandaily
China's AI Infrastructure Race Has Quietly Moved to "Supernodes"
At WAIC 2026, Biren, Yixin Intelligent, Infinigence CoreX, Kunlun Chip and SingularMOL all shipped supernode-scale systems. Single-chip heroics are officially over.