新加坡能否借后硅技术打造下一个半导体优势？
Can Singapore turn post-silicon technology into its next semiconductor advantage?
新加坡公司 Nexstrom 押注后硅材料和制造技术，想在硅之外的芯片价值链里找新机会，思路挺有意思。
新加坡半导体产业长期聚焦晶圆制造、封装与测试环节。随着芯片向更小尺寸、更高能效演进，可 complement 硅基芯片的材料与制造技术正成为价值链新看点。总部位于新加坡的 Nexstrom 正押注后硅技术方向，希望将其发展为新加坡的下一个半导体优势。
Can Singapore turn post-silicon technology into its next semiconductor advantage?
Southeast Asia’s semiconductor story has largely been told through fabs, assembly and testing. But as chipmakers push towards smaller, more powerful and energy-efficient devices, another part of the value chain is becoming important: the materials and manufacturing technologies that could complement silicon and help define the next generation of chips. Singapore-based Nexstrom is betting on […] The post Can Singapore turn post-silicon technology into its next semiconductor advantage? appeared first on Tech Collective .
