WSJ：Broadcom 为 OpenAI 自研芯片筹措逾 500 亿美元融资
OpenAI 自研芯片叫 Nexus，前两代叫 Jalapeño 和 Serrano，500 亿美元融资细节都在这篇里。
据 WSJ 报道，Broadcom 正在为 OpenAI 的定制芯片项目安排超过 500 亿美元融资，Apollo 和 Blackstone 是参与贷款方，目标在 2026 年底前完成。这笔资金将覆盖 OpenAI 与 Broadcom 计划到 2029 年部署的 10GW 算力中的数 GW，该内部芯片项目名为 Nexus，前两代芯片代号 Jalapeño 和 Serrano。此外，Oracle 正与 Apollo 和 Goldman Sachs 谈判一种租赁结构，由投资者出资设立单独公司购买芯片，Oracle 按云收入逐步支付，避免自身继续借贷。
WSJ: Broadcom is trying to arrange more than $50B in financing for OpenAI's custom chips, with Apollo and Blackstone among the lenders and a close targeted before the end of 2026.
That money could cover several gigawatts of the 10 gigawatts OpenAI and Broadcom plan to deploy through 2029, under an internal chip program called Nexus whose first 2 generations are named Jalapeño and Serrano.
Oracle is negotiating with Apollo and Goldman Sachs over a lease structure in which investors fund a separate company that buys the chips, so Oracle can pay as cloud revenue arrives without borrowing more itself.
