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CHIPS Act R&D Awards: Up to $389M for Power Semiconductor R&D to Four Companies

《芯片与科学法案》功率半导体研发资助计划(4 家企业,最高 3.89 亿美元)
美国商务部 (NIST)·Published 2026-10-23·Checked by 管理员 on 2026-10-27

On October 22, the U.S. Department of Commerce announced planned awards of up to $389 million under the CHIPS and Science Act R&D program to four companies for power semiconductor devices and key materials. Helion, Commonwealth Fusion Systems, Vertical Semiconductor and Sibelco are slated to receive up to $175M, $85M, $73M and $56M respectively, with some technologies targeting AI data center racks. As a condition, the government will take minority equity stakes in the awardees in final agreements.

What it means for you

  • Power semiconductor and materials suppliers can watch for follow-on application windows under the Commerce R&D program.
  • The awards are preliminary and subject to final agreements; final amounts and terms, including government minority equity stakes, will be set then.
  • Chip firms targeting AI data center power delivery can reference the funded directions such as vertical GaN power semiconductors.
  • What to do

    EveryoneTrack NIST final award agreements and subsequent funding rounds
    FinanceAssess alignment of company technology areas with the program and application routes
    LegalStudy implications of the minority-equity condition on grant application strategy

    Key dates

    2026-10-23Published

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