Chinese content美国拟向 4 家企业提供 3.89 亿美元半导体研发资金,Helion 获 1.75 亿居首
美国又发芯片钱了,Helion 拿走 1.75 亿美元做核聚变用的功率半导体,还有家公司的氮化镓直接瞄准 AI 数据中心,政府这次还要拿少数股权。
IT之家Source
On October 22, the U.S. Department of Commerce announced planned awards of up to $389 million under the CHIPS and Science Act R&D program to four companies for power semiconductor devices and key materials. Helion, Commonwealth Fusion Systems, Vertical Semiconductor and Sibelco are slated to receive up to $175M, $85M, $73M and $56M respectively, with some technologies targeting AI data center racks. As a condition, the government will take minority equity stakes in the awardees in final agreements.
美国又发芯片钱了,Helion 拿走 1.75 亿美元做核聚变用的功率半导体,还有家公司的氮化镓直接瞄准 AI 数据中心,政府这次还要拿少数股权。