#芯片散热

Huawei's LogicFolding solves stacked chip heat issues, potentially affecting ASEAN electronics manufacturing using advanced packaging.

官方一手pandaily@[email protected] (Pandaily)Source

大阪公立大学搞出个热器件，接近垂直角度就能定向控热，断电还能记住设置，比之前非要斜着照光的设计实用多了。