精选理由
中科院用3D打印弄出个新散热管，散热和吸水能力都是两倍，AI芯片再也不怕烫了。
中科院金属所成功开发Ω形通道热管，采用电化学3D打印制造梯度多孔毛细结构。该热管毛细力为传统设计的2倍，散热能力提升2倍，专为AI芯片高功率散热优化。该技术有望突破高功率芯片散热瓶颈。
原文 · pandaily
Chinese Scientists Develop New Heat Pipe Manufacturing Technology Using Electrochemical 3D Printing, Doubling Chip Cooling Capacity
CAS Institute of Metal Research develops Ω-channel heat pipe with gradient porous wick via electrochemical 3D printing, achieving 2x capillary force and 2x heat dissipation for AI chip cooling.