精选理由
中国厂商正在量产TGV玻璃基板，用于AI芯片封装，信号和散热比传统基板更好，HPC和AI加速器会受益。
中国TGV（通孔玻璃）玻璃基板制造商正扩大产能，以满足AI芯片封装需求。先进的玻璃中介层方案相比传统有机基板提供更优信号完整性和热性能，适用于高性能计算（HPC）和AI加速器。多家国内企业已启动量产线建设，推动该技术从实验室走向规模商用。
原文 · pandaily
Domestic TGV Glass Substrate Industry Explodes: Chinese Manufacturers Race to Scale Through-Glass Via Technology as AI Chip Packaging Demands New Substrate Solutions
Chinese TGV glass substrate manufacturers scale production for AI chip packaging, with advanced glass interposer solutions offering superior signal integrity and thermal performance for HPC and AI accelerators.