Synopsys与A*STAR合作解决AI芯片封装挑战
Synopsys, A*STAR team up to tackle AI chip packaging challenges
精选理由
Synopsys和新加坡A*STAR联手解决AI芯片封装难题，这是AI硬件领域的重要合作。
Synopsys与新加坡科技研究局A*STAR合作，解决AI芯片封装挑战。半导体竞争已从缩小晶体管转向多芯片组装和连接。双方将共同开发AI芯片封装解决方案，提高芯片可靠性和性能。
原文 · e27
Synopsys, A*STAR team up to tackle AI chip packaging challenges
For years, the semiconductor race was largely about making transistors smaller. That contest is far from over, but the AI boom has shifted part of the battleground elsewhere: how multiple chips are assembled, connected and kept reliable inside a single package. That is the problem Synopsys and Singapore’s Agency for Science, Technology and Research (A*STAR) […] The post Synopsys, A*STAR team up to tackle AI chip packaging challenges appeared first on e27 .