精选理由
三大EDA巨头在DAC 2026同时亮出智能体方案，Kimi K3已经连续干了48小时芯片设计，中国厂商也在抢这波机会。
DAC 2026上，Synopsys发布L1-L5自主等级路线图。Cadence推出AuraStack超级智能体，Siemens EDA发布物理验证的Fuse智能体。Kimi K3用48小时自主完成芯片设计。中国厂商Xpeedic、XEPIC、UniVista正在跟进智能体EDA。
原文 · Pandaily
AI Starts Designing Chips: EDA Giants Synopsys, Cadence, and Siemens EDA Open the Agentic AI War — Chinese Vendors See a Golden Window
At DAC 2026, Synopsys, Cadence, and Siemens EDA each unveiled agentic AI strategies for chip design, from Synopsys' L1-L5 autonomy ladder and Cadence's AuraStack super agent to Siemens' physics-verified Fuse agent. Kimi's K3 model designed a chip autonomously for 48 hours, and Chinese EDA vendors from Xpeedic to XEPIC and UniVista are racing to catch the wave.