TSMC CoWoS 先进封装涨价最高 20%，AI 芯片需求超出产能
TSMC 的 CoWoS 封装要涨价最高 20%，GPU、CPU、定制 ASIC 都在抢产能，设备交货已拖到 6-8 个月，这篇讲清了芯片产能卡在哪一环。
TSMC 计划将 CoWoS 先进封装价格上调最高 20%，因 AI 芯片对封装的需求超过供给。CoWoS 负责把 AI 处理器与高带宽内存封装在同一基板上，需求已从 GPU 扩散到服务器 CPU 和定制 ASIC，行业普遍预期涨幅在 10% 到 20%。设备交货周期从 3-6 个月拉长到 6-8 个月，产能短期难以扩张。TSMC 董事长 C.C. Wei 表示，5 倍于最大可光刻芯片面积的封装已量产且良率良好，9 倍和 14 倍封装在规划中。
TSMC is reportedly preparing another CoWoS price rise of up to 20% as AI packaging demand outruns supply.
CoWoS (Chip on Wafer on Substrate), joins an AI processor to its high-bandwidth memory on one densely wired base.
Demand has spread from GPUs to server CPUs and custom ASICs, so foundries and packagers expect 10% to 20% increases.
Supply can’t jump quickly, since equipment lead times stretched from 3-6 months to 6-8 months, and tool buyers no longer haggle.
Larger packages will deepen the squeeze, because they cut each tool’s hourly output, so even flat chip volumes need more machines.
They keep growing: TSMC chairman C.C. Wei says packages 5 times the largest printable chip are in mass production at excellent yields, with 9x and 14x planned.
