TSMC denies Nvidia pushed it into 3D DRAM plans
The real signal is that TSMC prefers profiting from memory-logic integration, like SoIC bonding, over entering the volatile DRAM business it has no planar process to compete in. Chip supply-chain watchers and AI hardware planners should track the NVHBM base-die plan, which would route Samsung, SK hynix and Micron memory through TSMC's 3nm packaging. That keeps foundry economics stable while Nvidia secures memory capacity.
TSMC says it will remain a pure logic foundry, denying a report that it had drafted 3D DRAM plans at Nvidia's request. Nvidia had motive to explore 3D DRAM, since AI demand has drained DRAM supply and memory availability now determines whether accelerators ship. Even Micron plans at least 4 more planar DRAM nodes before adopting 3D DRAM, meaning a TSMC entry could not ease shortages for at least 5 years. TSMC already earns memory revenue without making DRAM, by building HBM base dies and using SoIC hybrid bonding to attach memory to logic. A separate Korean report says Nvidia wants Samsung, SK hynix and Micron to build its custom NVHBM base dies on TSMC's 3nm process.
tomshardware: TSMC says it will stay a pure logic foundry, denying a report that Nvidia pushed it toward 3D DRAM.
There was a report that TSMC began drafting 3D DRAM plans after a request from Nvidia, its largest customer.
Nvidia has reason to look, because AI demand has drained DRAM supply and turned memory into the part that decides whether accelerators ship.
3D DRAM stacks memory cells vertically to raise capacity per wafer, yet even Micron plans at least 4 more planar nodes before adopting it.
That timeline means a TSMC entry couldn’t ease shortages for at least 5 years, and TSMC lacks a competitive planar DRAM process to build from.
Instead, it already profits from memory without making it, by building HBM base dies and bonding memory to logic with SoIC hybrid bonding.
Separately, a Korean report says Nvidia wants Samsung, SK hynix and Micron to build its custom NVHBM base dies on TSMC’s 3nm process, which would give TSMC memory revenue without DRAM’s price swings.
