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Oct 21
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IndustryUS vs ChinaMulti-sourceSelected71°16:11
Groq plans DRAM-stacked inference chip to fix SRAM capacity

The bonding method determines the outcome: 3DS adds capacity at DRAM speeds, while hybrid bonding delivers bandwidth much closer to SRAM, deciding how few chips are needed to serve large models fast. Inference infrastructure teams evaluating Groq-class LPUs versus Nvidia GPUs, and anyone tracking Cerebras, which plans DRAM stacking on its CS-6 wafer, should watch which route ships first. Capacity, not bandwidth, is emerging as the binding constraint across SRAM-first architectures.

Event
rohanpaul_ai@rohanpaul_aiSource
IndustryUS vs ChinaMulti-sourceSelected79°13:09
DeepSeek V4.1F shows 5x-7.4x decode edge on Ascend 950DT vs GB200

The cost crossover at 6.8K tokens/s/chip reframes the Ascend-versus-Blackwell debate from raw benchmark losses to workload-dependent economics, suggesting DeepSeek could run its API on a sub-US$1B Blackwell cluster while pivoting post-training to Ascend. Practitioners tracking inference infrastructure or Huawei's CANN ecosystem get a rare concrete per-chip price and throughput comparison. The proposed 128-chip Ascend supernode topology has no Nvidia equivalent, which matters for anyone planning large-scale decode deployments.

Event
Teortaxes@teortaxesTexSource

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